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14S PA Hot Melt Adhesive Powder

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14S PA Hot Melt Adhesive Powder

Name: 14S PA Hot Melt Adhesive Powder
Brand: Easun
Price: 1 USD

Cheap 14S PA Hot Melt Adhesive Powder wholesale

Brand Name : Easun

Model Number : ES212

Certification : Rosh, Reach

Place of Origin : China

MOQ : 20KG

Price : Negotiable

Payment Terms : T/T

Supply Ability : 4000000

Delivery Time : 3-8 working day

Packaging Details : 20KG/bag

Color : White Hot Melt Glue Powder

Composition : Polyamide

Appearance : Powder

Melt Point(DSC) : 105-130 ℃

Melt Flow Index : 42±3 g/10min

Time : 14S

Powder size range : 0-80μm; 80-200 μm;150-250 μm

Density : 1.10±0.02 g/cm³

Packaging : 20KG in one PE bag+Brown paper

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14S PA Hot Melt Adhesive Powder

Polyamide PA Hot Melt Glue Powder For Heat Transfer

Hot Melt Glue Powder model: ES212

Description:The product is polyamide thermoplastic powder hot melt adhesive.It has excellent processability.It has good adhesion and good washing resistance to textile fabrics.

Function:Heat transfer,Silk screen printing.

Physical Characteristics:

Property	Criterion
Appearance	White powder
Composition	TPU
Density ASTM D-792	1.10±0.02 g/cm³
Melt Point DSC	105-130 ℃
Melt Index ASTM D-1238	42±3 g/10min
Powder size range	0-80 um
	0-170 um
	80-200 um
	150-250 um

Technical Parameters:

Bonding parameters (for reference only)	Temperature	135℃
	Press	0.5-1.5 kg/cm2
	Time	14S
Washing Resistance	40℃	Excellent
	60℃	/
	90℃	/

Packaging and Storage Conditions:

Packaging	20KG in one PE bag+Brown paper bag
Storage Conditions	Stored in dry unopened packaging at room temperature for 12 months. High temperature and pressure will cause agglomeration. The trays cannot be double-pressed.

1. Bonding temperature and pressure and time relate to the bonding strength of the film to the material. The bonding temperature must be close to the temperature set by the machine, the pressure must be uniform, and the mold and press rolls must be flat.
2. The bonding conditions used will vary between machines and materials. The conditions indicated here are only basic. The most ideal bonding conditions should be established by manufacturing for the specific application.

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